--- title: Global Markets Growing Strongly for Surface-Mount Radio-Frequency (RF) Electronics Technology description: Although most manufacturers of RF modules offer their products in connectorized form, this old-fashioned approach is coming to an end. image: https://blog.marketresearch.com/hubfs/Images/Blog_Images/Blog_Sarah/RF%20Technology.jpg --- [![MarketResearch.com](https://blog.marketresearch.com/hs-fs/hub/209482/file-22777923.gif?width=295&height=66&name=file-22777923.gif "MarketResearch.com")](https://www.marketresearch.com/) [Market Research Blog](https://blog.marketresearch.com/) # Global Markets Growing Strongly for Surface-Mount Radio-Frequency (RF) Electronics Technology by [Terry Edwards](https://blog.marketresearch.com/author/terry-edwards), on August 2, 2017 ![RF Technology.jpg](https://blog.marketresearch.com/hs-fs/hubfs/Images/Blog_Images/Blog_Sarah/RF%20Technology.jpg?width=204&height=204&name=RF%20Technology.jpg)Check any trade magazines such as *Microwaves & RF* or *Microwave Journal*, and it rapidly becomes clear that most manufacturers of RF modules offer their products in *connectorized* form. In this context, connectorized means metal or plastic containers that have standard coaxial connectors screwed into place for the signal lines. But this somewhat old-fashioned approach is steadily coming to an end — or at least toward merely a trickle. The market success of mainstream electronics, including RF and microwave, demands the following manufacturing criteria be met: - High and repeatable reliability; - The availability of surface-mountable parts, ready for; - Increasingly automated assembly at the lowest possible cost; - Aiming toward subsystems comprising complex integrated assemblies. Connectorized modules do not achieve *any *of these criteria. Therefore, whilst many complex integrated assemblies will likely continue to be manufactured and marketed in connectorized format — parts having lower levels of complexity are increasingly being manufactured in surface-mount packages the most popular of which is the QFN (Quad-Flat No-lead) package. With this type of technology, all connections to the underlying circuit-board and chip are made through matching arrays of surface conducting pads. The photo above shows a 28-pad square QFN package (inverted) that has side dimensions 5 mm (200-mil). Some RF-oriented QFN packages have as many as 48 pads. The semiconductor chips — assembled within the QFN — are currently mainly gallium arsenide (GaAs) or gallium nitride (GaN), but the strong trend is toward *silicon* implementations. Complex integrated assemblies such as frequency converters or synthesizers already implement QFN-based internal parts that **currently attract markets valued at several billion dollars — and increasing**. Currently over 40 globally based manufacturers supply QFN-based RF technology products, amongst these manufacturers: MACOM (USA), Microsemi (USA), Qorvo (USA) and Transcom (Taiwan). To learn more about the players and the industry as a whole, check out the reports published by Engalco Research. [![Click to Reports by Engalco Research](https://no-cache.hubspot.com/cta/default/209482/3476b454-b32c-41a3-9267-6dc42af29d6f.png)](https://cta-redirect.hubspot.com/cta/redirect/209482/3476b454-b32c-41a3-9267-6dc42af29d6f) --- **About the Author: **Terry Edwards is the Executive Director of [Engalco Research](https://www.marketresearch.com/Engalco-v3148/?progid=89869), which provides forecasts for products associated with the RF and microwave industry.  Topics: [Computer Hardware & Networking](https://blog.marketresearch.com/topic/computer-hardware-networking) [Industry Insights](https://blog.marketresearch.com/topic/industry-insights) - [Tweet](https://twitter.com/share) [![Will Self-Driving Vehicles Be a Reality by 2025? 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